BGA PCB Assembly: Precision Engineering for High-Density Electronics
At Fanway, we master BGA (Ball Grid Array) assembly, delivering perfect performance for your most complex and mission-critical PCB designs. With advanced technologies and decades of expertise, we ensure your high-density boards meet the strictest reliability standards.
Our BGA Assembly Capabilities
|
Paramete |
Specification |
| BGA Size Range |
5mm x 5mm to 45mm x 45mm |
| Ball Count |
Up to 2,500 I/Os |
| Solder Ball Diameter |
0.15mm ~ 0.76mm |
| Inspection | 3D X-Ray, Automated Optical (AOI) |
|
Materials |
Lead-free, Halogen-free, or customized alloys |
Industries We Serve
Data & Telecom: 5G baseband processors, network switches, and optical modules.
Medical Imaging: BGA-based control boards for MRI and ultrasound systems.
Automotive ECU: AEC-Q100 Grade 2 assemblies for ADAS and infotainment.
Industrial AI: High-power BGAs for edge computing and robotics.
Shenzhen Fanway Technology Co., Ltd
Office Add: F601, Industrial Building of Hengtai, Tangkeng Road, Guantian Community Shiyan Street, Bao'an District, Shenzhen, Guangdong, China, 518108
Factory Add: F2, Building 3, The First Industrial Zone of Mingjinhai, Shiyan Street, Bao'an District, Shenzhen, Guangdong, China, 518108
E-mail: kate@fanwaypcba.com
Cell: +8615013656200
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